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Surface mount technology industry trends and Indian perspect Kumar, K. Sarnot S. L.

By: Kumar, K. Sarnot S. L
Material type: ArticleArticlePublisher: 1998Description: pp.177-183Subject(s): Chip Scale Packaging | Flip Chip Technology | Multi Chip Modules | Ball-Grid Technology | Fin Pitch Technology | Minaturization In: ELECTRONICS INFORMATION & PLANNING
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Item type Current location Call number Vol info Status Date due Barcode
Articles Articles Ahmedabad (HO)
(Browse shelf) Vol. 25, Issue. 4 Available 001799

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